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From: Javad Benhangi on 7 Jun 2010 11:15
Thank you everybody.
I have a question on PCB manufacturing. I have designed an eight layer
board (Top Signal | Power Plane | Gnd | Mid1 Signal | Gnd | Mid 2
signal | Gnd | Bottom Signal).
I have some problems with the PCB board. There are five BGA chips on
it that according to their montage profile the temperature should
reach up to 260 degrees centigrade but the board color and its shape
changes as the temperature reaches 220. When I send the problem to the
PCB manufacture they said that ere made as regular FR4 material and
tin-lead finish and it shouldn’t use in using RoHS temperature
profile. I think they should let me know about possible board montage
problem and ask me about this option before start manufacturing it
because I said them that this is the first experience of mine.
Anyway, I’m going to reorder the board but I really don’t know what
possible options for the board manufacturing are. What I know is just
that A) the board should stand temperature over 260. B) The board
should stand multiple montages and de-montage process As the frequency
if high, what kind of FR4 board is the best? What is the PCB board
electrical test report like? They said to me that they have
electrically tested the board but the board had some manufacturing
fault?
Many thanks
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