From: Fred Bartoli on 24 Feb 2010 19:20 Searching for some small components I came over that one. http://us1.st.com/stonline/products/literature/ds/15894.pdf Page 6 : � Micro via SSBU allowed � Micro via SBU to be avoided What's the difference between SSBU and SBU vias that make the SBU to avoid? From www.acb.be/downloads/Technology%20Overview_2008_V11.pdf page 37, I can't see anything making a difference. So...? -- Thanks, Fred.
From: Spehro Pefhany on 24 Feb 2010 21:31 On Thu, 25 Feb 2010 01:20:44 +0100, the renowned Fred Bartoli <myname_with_a_dot_inbetween(a)free.fr> wrote: >Searching for some small components I came over that one. > >http://us1.st.com/stonline/products/literature/ds/15894.pdf > >Page 6 : > >� Micro via SSBU allowed >� Micro via SBU to be avoided > >What's the difference between SSBU and SBU vias that make the SBU to avoid? > > From www.acb.be/downloads/Technology%20Overview_2008_V11.pdf >page 37, I can't see anything making a difference. > >So...? The microvias look to be about 1/3 as deep with SSBU, no? Best regards, Spehro Pefhany -- "it's the network..." "The Journey is the reward" speff(a)interlog.com Info for manufacturers: http://www.trexon.com Embedded software/hardware/analog Info for designers: http://www.speff.com
From: Glen Walpert on 25 Feb 2010 09:44 On Wed, 24 Feb 2010 21:31:55 -0500, Spehro Pefhany wrote: > On Thu, 25 Feb 2010 01:20:44 +0100, the renowned Fred Bartoli > <myname_with_a_dot_inbetween(a)free.fr> wrote: > >>Searching for some small components I came over that one. >> >>http://us1.st.com/stonline/products/literature/ds/15894.pdf >> >>Page 6 : >> >> Micro via SSBU allowed >> Micro via SBU to be avoided >> >>What's the difference between SSBU and SBU vias that make the SBU to >>avoid? >> >> From www.acb.be/downloads/Technology%20Overview_2008_V11.pdf >>page 37, I can't see anything making a difference. >> >>So...? > > The microvias look to be about 1/3 as deep with SSBU, no? Where did you see that? As I read it, the design rules for microvia depth are the same for SBU (Sequential Build-Up) and SSBU (Semi- Sequential Build-Up). The SSBU consists of two or more SBUs laminated together. In either case there is a limit of two layers of microvia per side per build with the current recommended process; using 2 SBUs in a SSBU allows 8 layers of uvia vice 4 with SSU and it is hard to see how this is better except for routing density. But perhaps I am missing something ...
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