From: Bo-Ming Tong on
On Dec 27 2009, 11:12 am, krw <k...(a)att.bizzzzzzzzzzz> wrote:
> It should, though it's a lot harder to get right than aBGA, for
> instance.  The center pad works against you, where in aBGAall the
> balls work in your favor.  Since the pad is huge, in proportion to the
> pins, it can get dicey.  Even with automatic PnP, we have far more
> problems with QFNs than BGAs.  Of course the crappy RoHS processes
> make things far worse.

I have a naive question. Do I still print solder paste on the PCB with
a stencil for BGA's? (Given that the balls themselves are solder.)