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From: Bo-Ming Tong on 15 Jan 2010 05:28 On Dec 27 2009, 11:12 am, krw <k...(a)att.bizzzzzzzzzzz> wrote: > It should, though it's a lot harder to get right than aBGA, for > instance. The center pad works against you, where in aBGAall the > balls work in your favor. Since the pad is huge, in proportion to the > pins, it can get dicey. Even with automatic PnP, we have far more > problems with QFNs than BGAs. Of course the crappy RoHS processes > make things far worse. I have a naive question. Do I still print solder paste on the PCB with a stencil for BGA's? (Given that the balls themselves are solder.)
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