Prev: Plateform FLASH PROM configuration using a Microblaze.
Next: Microblaze FSL peripheral problem
From: Jon Elson on 13 Mar 2006 14:54


Paul van der Linden wrote:

> Hi,
> I'm very new to fpga, just came interrested in these things.
> The only problem I think I will have is the soldering.
> How to solder fpga's on the boards? I'm a student so I don't have money
> for very expensive machines.
> I want to be able to solder the whole range of packages of Xilinx
> spartan 3e, will that be possible with not to expensive tools?
>
> Package types:
> Table 121: Xilinx Package Mechanical Drawings
> Package Web Link (URL)
> VQ100 / VQG100: http://www.xilinx.com/bvdocs/packages/vq100.pdf
> CP132 / CPG132: http://www.xilinx.com/bvdocs/packages/cp132.pdf
> TQ144 / TQG144: http://www.xilinx.com/bvdocs/packages/tq144.pdf
> PQ208 / PQG208: http://www.xilinx.com/bvdocs/packages/pq208.pdf
> FT256 / FTG256: http://www.xilinx.com/bvdocs/packages/ft256.pdf
> FG320 / FGG320: http://www.xilinx.com/bvdocs/packages/fg320.pdf
> FG400 / FGG400: http://www.xilinx.com/bvdocs/packages/fg400.pdf
> FG484 / FGG484: http://www.xilinx.com/bvdocs/packages/fg484.pdf

The flat packs are solderable by hand. I do various chips, including
FPGAs with up to 0.5 mm lead pitch. I use solder paste, and a soldering
iron with a VERY fine point. I work under a stereo zoom microscope.
You may be able to use one at your school, and bring the rest of the gear
to it. I specifically have done the TQ144, which is 0.5 or 0.65 mm spacing,
I forget. The BGAs can't be soldered by hand, because the balls are between
the board and the package. You pretty much need an X-ray system to check
the soldering, too. Also, note that some of these larger BGA parts are
REALLY expensive.

Jon

From: Jon Elson on 13 Mar 2006 16:34


Paul van der Linden wrote:

> Eli Hughes wrote:
>
>> The QFP devices (VQ100, TQ144 and PQ208) are do-able with some
>> practice with a standard soldering iron and some wick.
>
> How thin should the soldering iron be?

Weller has some micro-pencil irons like the EC1302 (vintage) and the WMP
(current).
They have conical pointed tips for all of these, that essentially go to
a real point. You
wipe the iron gently down the row of leads, touching both the end of the
lead and the
solder pad at the same time. If the right amount of solder paste is
used (very sparingly)
the surface tension will break the bridge of solder as you work down the
side. There
will be a bridge between the two leads that the soldering iron is on at
any one time,
but the iron pulls it along as you move. The alignment takes a couple
of minutes, then
the soldering goes very quickly.

>
>> Your best best is to get a development board to experiment. If you
>> need a standard alone module check out the Avnet Virtex 4 Mini module
>> or the devices from Xess.
>
> The problem with the standard development board, is that they are
> expensive (starting from 150 dollar or something). But I think I will
> buy one.
>
> And I was also thinking of the feature, I want to be able to make my
> own devices, and using start kits for a final devices isn't right.


> I've never used the starter kits, either.


Jon

From: Jon Elson on 13 Mar 2006 16:37


aiiadict(a)gmail.com wrote:

>how about a BGA to DIP converter socket?
>
>or, a BGA part pre-soldered to a board with
>through-holes for attaching connectors, wires,
>etc?
>
>
It really won't work. You could put the necessary
decoupling capacitors on the adaptor, but what DIP
would you use? The original post was talking about
480 pin devices!

>
>
Jon

From: Nial Stewart on 14 Mar 2006 10:19
>> Look at the range of Metcal tips. A drag-hoof tip works best for QFPs
>> and TQFPs.
>
> We have the Metcal irons and a drag-hoof tip. Although I've only had success with paste and the
> hoof tip, I've seen techs that are able to wet the tip and drag it on the pins nicely. Definitely
> something I don't have the hands for.


I can do this repeatedly well with a normal thickish tip, the secret
is to flood the area with flux before you start and do it before the
flux dries.



Nial.


From: John Adair on 14 Mar 2006 11:46
Maybe not quite what your are looking for but we have a new add-on module
that can be used as simply as a XC9572XL CPLD holder. It is actually an IDE
interface but can be made to do a number of things by programming your
design into the CPLD. Pinned out on 0.1 inch pitch is relatively easy to use
on a stripboard. Picture on our Raggedstone1 webpage if you are interested.

John Adair
Enterpoint Ltd. - Home of Raggedstone1. The low Cost Spartan-3 Development
Board.
http://www.enterpoint.co.uk

"Paul van der Linden" <msn(a)paultjuh.org> wrote in message
news:44159b38$0$2337$2e0edba0(a)news.tweakdsl.nl...
> Hi,
> I'm very new to fpga, just came interrested in these things.
> The only problem I think I will have is the soldering.
> How to solder fpga's on the boards? I'm a student so I don't have money
> for very expensive machines.
> I want to be able to solder the whole range of packages of Xilinx
> spartan 3e, will that be possible with not to expensive tools?
>
> Package types:
> Table 121: Xilinx Package Mechanical Drawings
> Package Web Link (URL)
> VQ100 / VQG100: http://www.xilinx.com/bvdocs/packages/vq100.pdf
> CP132 / CPG132: http://www.xilinx.com/bvdocs/packages/cp132.pdf
> TQ144 / TQG144: http://www.xilinx.com/bvdocs/packages/tq144.pdf
> PQ208 / PQG208: http://www.xilinx.com/bvdocs/packages/pq208.pdf
> FT256 / FTG256: http://www.xilinx.com/bvdocs/packages/ft256.pdf
> FG320 / FGG320: http://www.xilinx.com/bvdocs/packages/fg320.pdf
> FG400 / FGG400: http://www.xilinx.com/bvdocs/packages/fg400.pdf
> FG484 / FGG484: http://www.xilinx.com/bvdocs/packages/fg484.pdf


First  |  Prev  |  Next  |  Last
Pages: 1 2 3 4 5
Prev: Plateform FLASH PROM configuration using a Microblaze.
Next: Microblaze FSL peripheral problem