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From: Eli Hughes on 14 Mar 2006 13:25
Markus Zingg wrote:
>>The BGA parts will probably not be within your capabilities. I have
>>baked my own chips on before, but be prepared to ruin a few chips.
>
>
> May I ask wether you ruin a few chips "per run" or up until one get
> used to the process? What kind of oven are you using?
>
> Markus
>


Toaster Oven,

and just until I get used to the process.



Its alot easier to have an assembly house with the correct tools to do it!

From: Eli Hughes on 14 Mar 2006 13:27
Paul van der Linden wrote:
> Eli Hughes wrote:
>
>> The QFP devices (VQ100, TQ144 and PQ208) are do-able with some
>> practice with a standard soldering iron and some wick.
>
> How thin should the soldering iron be?
>
>> Your best best is to get a development board to experiment. If you
>> need a standard alone module check out the Avnet Virtex 4 Mini module
>> or the devices from Xess.
>
> The problem with the standard development board, is that they are
> expensive (starting from 150 dollar or something). But I think I will
> buy one.
>
> And I was also thinking of the feature, I want to be able to make my own
> devices, and using start kits for a final devices isn't right.
> Paul



I actually use a very fat soldering tip and regular solder. As long as
things are aligned, it will go smoothly. Also, If you have solder
bridges, dont worry, just wick off the extra solder. It's next to
impossible to get all of the solder from under neath a pin, so its easy
to clean up the solder bridges. Just run a toothpick across the pins
to make sure they are soldered down.

This isn't probably the best process for a production run, but you can
get prototypes working with little hassle.

-Eli

From: Jeremy Stringer on 15 Mar 2006 17:12
metal wrote:
> I've done qfp's, but never had a need to do BGA's; but am now
> expecting it to come up soon; so I appreciate you taking the time to
> give that detailed process-description.

I'd second that :) That was an interesting post.

Jeremy
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